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tIgh manufactur targhHom veDDaq noch chut lulajpu'bogh pcb tIj pcba Electric Fireplace

tIgh manufactur targhHom veDDaq noch chut lulajpu'bogh pcb tIj pcba Electric Fireplace

pcb chut lulajpu'bogh targhHom veDDaq noch manufactur tIgh tIj pcba electric fireplace Product description Product Description targhHom veDDaq noch ghor Mount cham rIp tlhegh "Reflow soldering mIw Hay'DI' solder paste (Hum mixture 'och tIq solder flux 'ej) DanoHmeH …

Product Details

pcb chut lulajpu'bogh targhHom veDDaq noch manufactur tIgh tIj pcba

electricfireplace

product description

logo

product Description

targhHom veDDaq noch ghor Mount cham rIp tlhegh

andquot;reflow solderingis net Hay'DI' (Hum mixture paste solder mIwsolder flux 'ej 'och tIq) lo'

temporarily wa' pagh puS attachelectrical 'ay' contact pads, qaSpu'DI' rIp naQ
subjected yISeH tuj, baS solder, tet permanentlypemvaD rar. shenzhensunsoarcircuitfactory.

establishedin2008, ahigh-endpcbandamp; pcbamanufacturerinpcbandcomponentsassemblyfields..andquot;

Qaghbe'meH pcb wavesolderingservice fromsunsoar Circuit

andquot;pcb joq soldering 'ej pa' manufacture printed circuit tIj lo' mIw soldering. circuit tIj

juS rIn mI molten solder, pa''e' upwelling solder 'ej QuQ 'e' legh rur patlh joq lIng pump.

lach'eghDI' pcb joq tlhegh soldering chaq shenzhen sunsoar Circuit laSvargh 'ej manual ngoSmo' tlhegh soldering, laH ghom 'oH

nIS pIm customer.andquot;

jIHtems

PCBrIptechnicalData

1.

targhHom veDDaq noch ghor-mounting vegh-qung solder cham je

2.

Sar sizes rurBGA, QFN, 0402, 0201'ay' smt cham

3.

ict (qaStaHvIS waH Circuit), fct (Functional Circuit waH) cham.

4.

PCByej je ul, ce, fcc, rohs Approval

5.

solder cham reflow voQSIp SIp smt

6.

jen Hol smtandamp; yej tlhegh solder

7.

jen ghu'vetlh, interconnected tIj placement cham capacity

8.

waH Qap aoi waH fuction waH.

PCB assembly 4.jpg

PCB assembly1.jpg


'utmo' Dujvam

product Capability
SHENZHENYUZHIXIANGELECTRONICSCO., LTD
vuS sunsoarprecisionelectronic (hk)
productioncapability
teywI'gerber, protel, powerpcb, autocad, orcad, etc
Hap 'u'FR-4,Hi-TgFR-4,LeadfreeMaterials(RoHSCompliant),22F,CEM-1,Aluminium,HighfrequencyMaterial(Rogers,Teflon,Taconic)
layerno.1-20layers
boardthickness0.0075andquot;(0.2mm)-0.205andquot;(5.2mm)
boardthicknesstolerance±10%
copperthickness0.5 OZ-5 OZ
impedancecontrol±10%
warpage0.075%-1.5%
peelable0.012andquot;(0.3mm)-0.02'(0.5mm)
mintracewidth(a)4mil(0.1mm)
minspacewidth(b)4mil(0.1mm)
minannularring0.15 mm
min.bgapitch(b)0.25 mm
minsoldermaskdam(a)0.005andquot;(0.125mm)
soldermaskclearance(b)0.005andquot;(0.125mm)
minsmtpadspacing(c)0.004andquot;(0.1mm)
soldermaskthickness0.0007andquot;(0.018mm)
holesize0.01andquot;(0.25mm)--0.257andquot;(6.5mm)
holesizetol(+/-)±0.003andquot;(±0.0762mm)
aspectratio6:01
holeregistration0.004andquot;(0.1mm)
HASL2.5um
leadfreehasl2.5um
immersiongoldnickel3-7umau:1-3uand 39 vIlopQo' jay';
OSP0.2-0.5um
paneloutlinetol(+/-)±0.004and#39;(±0.1mm)
bevel30 ° 45 °
LUT VAGH-pe'15 ° 30 ° 45 ° 60 °
surfacefinish

hasl, haslleadfree, immersiongold, goldplating, goldfinger, immersionsilver

immersiontin, osp, Carbon INK

certificateROHSISO9001:2000SGSUL
specialrequirementsburiedandblindvias, impedancecontrol, viaplug, bgasolderingandgoldfinger
tlhegh production


tuj-ngev Products

PCB prototype 2_.jpg

Prototype PCB assembly 1.jpg

Flexible PCB 5_.jpg

01_


certification

1

packagingandamp; Duj

1

2



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